In reality, the classification according to package of the optical module is the most common method.
1 X9 package
1 X9 package optical modules, sometimes also called the 9-pin or 9PIN optical module, the name suggests, this fiber optic module nine PIN angle is the most common of the early optical module package, the type of very large market demand ,mainly used in fiber optic transceiver, PDH Optical, optical switches, single Multi-mode converter as well as some industrial control applications.
GBIC package
GBIC transceiver, the abbreviation of the Giga Bitrate Interface Converter upcoming gigabit electrical signal is converted to optical signals module. GBIC designed for hot-plug. GBIC is interchangeable products meet international standards. This Gbic optical module used widely before SFP package. That is gradually being replaced after the SFP optical module lauched. They have basically been eliminated on the currently market in addition to some older models of equipment still using.
SFP package
SFP transceiver, Small Form-factor Pluggables, small hot-pluggable optical module is an upgraded version of the early GBIC module, the volume smaller, higher integration than the GBIC fiber module, which is currently on the market's most popular optical module,
XFP package
XFP transceiver, 10 Gigabit Small Form Factor Pluggable, is a hot-swappable, independent of the communication protocol optical transceivers, the XFP is usually used to 10G bps SONET / SDH, Fibre Channel, Gigabit Ethernet and other applications, but also of CWDM DWDM link.
Relative to the 1X9 and SFP modules, XFP has a higher transmission rate and transmission capacity, so the price is much higher than ordinary fiber module.
SFP + package
SFP + optical modules, SFP PLUS optical module, SFP optical module upgrade, with a higher transmission rate, usually up to 8.5G or 10G, the size of the XFP module, this module than earlier smaller at the same time have the same rate, so for communications equipment manufacturers in the same space to deploy a more intensive light module offers the possibility, so more and more applications.
XPAK package
The XPAK optical module definition same with Xenpak, because it is a 4-channel (10 Gbps attachment-unit interface) connection at the physical layer /
Media access controller interface to partition the modular I / O channels. Use Xpak the Xenpak output pin, but there is one exception, that is, it including Xenpak standard version in the future not on the clock signal. Compared with Xenpak module size Xpak share space on the I / O cards .Between than the Xenpak small. In fact Xpak Xenpak module directly improved version of the volume reduced by half of the optical interface, electrical interface with the original Consistent.
The XPAK optical module definition same with Xenpak, because it is a 4-channel (10 Gbps attachment-unit interface) connection at the physical layer /
Media access controller interface to partition the modular I / O channels. Use Xpak the Xenpak output pin, but there is one exception, that is, it including Xenpak standard version in the future not on the clock signal. Compared with Xenpak module size Xpak share space on the I / O cards .Between than the Xenpak small. In fact Xpak Xenpak module directly improved version of the volume reduced by half of the optical interface, electrical interface with the original Consistent.
XENPAK package
XENPAK transceiver 10 Gigabit Ethernet optical transceivers (independent of the transceiver circuits and optical components of optical signals for small devices, with Standard Specification for switches and routers, the interface part). Agere, Agilen,, Mitsubishi, Pine Photonics, Tyco and Defined Optillion companies xENPAK Working Group, provides for the product dimensions, light plug type and electrical pin-out configuration and power Energy and other parameters
X2 package
X2 transceiver is based on the XENPAK Multi-Source Agreement optical module that occur before, but more than XENPAK optical modules more of the smaller size and volume of the module and Parameters similar to XENPAK, about the size of the XENPAK the half the size of.
SFF is divided into 2X5 pin or needle 2X10 can be soldered directly on the device.
SFF is divided into 2X5 pin or needle 2X10 can be soldered directly on the device.
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